Established in 1997 in the Hsinchu Science Park, Nutex Communications is an experienced provider of IC packaging/assembly and testing services for thin FQN and SIP modules. With an established record of speed and versatility, we can guarantee our customers quick turnaround times and high levels of customization, ideal for engineering experimental lots and small volume runs.
With a turnaround time of 48 hours for engineering hot runs and 5 days for mass production runs, Nutex's speed and agility make us the ideal choice for experimental lots and small volume runs.
We offer packaging solutions for a broad selection of package types (e.g. surface mount, flat packages, ball grid array, etc.) and testing solutions for several different categories of ICs including mixed-signal, analogy, and RF. Due to the breadth of our capabilities, our bespoke assembly and testing services are tailored specifically to fit each client's needs.
Founded in 1997, Nutex brings our customers a quarter of a century of experience and expertise in the competitive, constantly evolving semiconductor packaging and testing industry, as well as a track record of reliability and innovation.