Work

Our Services

IC Packaging:

From IC bonding to encapsulation to wafer bonding, Nutex offers a wide range of highly customisable assembly solutions—multi-chip IC assembly, RF module assembly, and power IC assembly—for numerous package types: surface mount, small outline, chip carrier, flat packages, ball grid array, among others.

IC Testing:

Nutex's facilities are equipped to provide testing services for mixed-signal, analog, and RF ICs, with a strong focus on decreasing the time-to-market of our customers' products by increasing product quality and consistency. Our testing solutions include yield analysis and improvement, test time reduction, wafer level package backend processing, probe card services, and wafer probing.

quality assurance:

Nutex holds ISO 9001:2015 certification. With our strict adherence to the criteria established by the internationally recognized ISO 9001 standard, we ensure the effective operation of our quality management system while focusing on continual improvement and guaranteed compliance with not only our customers’ requirements but all relevant laws and regulations. Our emphasis on prioritizing quality above all else serves as our guiding management principle, allowing us to consistently go above and beyond our customers’ expectations.